Awinic

Package information

awinic's innovative approach to packaging helps customers differentiate their products and enables further cost-effective advancements in miniaturization and performance. Our product widely used for communication、intelligent electronic,automotive electronics other fields. Assembly type include QFN、TSOP、WLCSP、BGA、LGA, fine pitch wire bond, flip chip, stacked die and fan-in/out WLCSP, and more.

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Search various package families to find technical specifications such as dimension, pin count, pitch, and package drawing.

SMT & Package application notes

Get documentation on awinic's surface mount technology (SMT), and find application notes on a variety of packaging topics.

Find products by package

Search packaging information on awinic products by part number, package name or pin count for package drawing, footprint information and more.